leaded oscillator, ocxo metal package, full size dip i401 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 01/11_c specifications subject to change without noti ce p age 1 12.6 20.7 15.24 12 3 4 dimension units: mm pin connection 1 control voltage 2 gnd 3 output 4 vcc i401 package 0.86 0.048 6 min. 10 max. 7.62 product features: applications: available in both sinewave and telecommunications hcmos/ttl compatible outputs data comm unications rohs compliant instrumentation test and measurement note: a 0.01 f bypass capacitor is recommended between vcc (pin 4) and gnd (pin 2) to minimize power supply noise. * frequency, supply, and load related parameters. frequency 1.000 mhz to 50.000 mhz output level hc-mos ttl sine ?0? = 0.1 vcc max., ?1? = 4.5 vdc min. ?0? = 0.4 vdc max., ?1? = 2.4 vdc min. +4dbm, 3dbm duty cycle 50% 10% or 5% see table rise / fall time 10 ns max. output load hc-mos ttl sine see output table 15 pf 50 ohms frequency stability see frequency stability table supply voltage see supply voltage table current (warm up) current @ 25 ? c 400 ma @ 5 vdc, 170 ma @ 12 vdc max. 120 ma @ 5 vdc, 60 ma @ 12 vdc typ. control voltage 2.5 vdc 2.0 vdc, 8 ppm min. slope positive operating see operating temperature table in part number guide storage -55 ? c to +125 ? c part numberguide sample part number: i401-5151yv-20.000 mhz package input voltage operating temperature symmetry (duty cycle) output frequency stability (in ppm) voltage control frequency i401 - 3 = 3.3 v 7 = 0 ? c to +50 ? c 5 = 45 / 55 max. 1 = 10 ttl / 15pf hc-mos n = ? 1.0 v = controlled -20.000 mhz 5 = 5.0 v 1 = 0 ? c to +70 ? c 6 = 40 /60 max. 3 = 15pf hc-mos y = ? 0.5 f = fixed 9 = 12 v 6 = -10 ? c to +75 ? c 6 = 30pf 1 = ? 0.25 3 = -20 ? c to +70 ? c a = sine 2 = ? 0.1 3 = ? 0.05*
leaded oscillator, ocxo metal package, full size dip i401 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 01/11_c specifications subject to change without noti ce p age 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e1 (sn / cu / ag over ni over kovar base metal). environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: ilsi and date code line 2: xxxxxx (part number detail = i401-xxxxxx-freq.) line 2: frequency
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